2SOLID AI — Engineering
Engineering
Computer-science engineering, end to end. Software systems, models and memory, and the silicon they run on — designed and built by one team, from research to release.
Scope your system§01 — SCOPE
One team, schematic to shipped system.
The practice covers the full computational stack: the software a business runs on, the models that reason over it, and the boards it all executes on. Each discipline page below documents its own instrument — the physics running live in its hero is evidence, not decoration.
§02 — DISCIPLINES
Three disciplines, one roof.
SYSTEMS LAYER
Software Engineering
Enterprise applications, integrations, automation — specified, reviewed, and tested. Built to run for years.
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INTELLIGENCE LAYER
AI & Machine Learning
Agent systems, persistent memory architectures (4DAM), model integration, verification layers.
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PHYSICAL LAYER
PCB & Embedded
Schematic capture, layout, firmware, first-article bring-up — hardware validated against the datasheet.
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§03 — METHOD
Research, validation, release — in that order.
Every engagement runs the same five stages. Gates are not skipped because a demo looked good.
Stage 01 — Research
Requirements dossier, constraints, interface inventory. Physics and datasheets before opinions.
Stage 02 — Architecture
Data models, protocol choices, stack decisions — documented, argued, frozen.
Stage 03 — Build
Versioned, reviewed, tested as it lands. Nothing merges without a reader.
Stage 04 — Validation
Measured against spec — test suites, bring-up rigs, acceptance criteria written at Stage 01.
Stage 05 — Release
Deployed, documented, handed over with the evidence trail intact.
§04 — INSTRUMENT
This hero is a computed field, not a stock video.
Every discipline hero on this site is a live simulation running in your browser. This one is a parametric surface — four traveling modes plus a driven dome — sampled on a lattice and descended by particles. The datasheet:
| 01Surface field | z = Σᵢ aᵢ·sin(kxᵢ·2πu − ωxᵢt)·sin(kyᵢ·2πv − ωyᵢt) | four traveling modes, separable evaluation |
|---|---|---|
| 02Driven term | (46 + 22·sin 0.5t)·e^(−9d²) | breathing Gaussian dome at u ≈ 0.62 |
| 03Lattice | 46 × 30nodes | 34 × 22 below 720 px viewport |
| 04Transport | u̇ = −0.00035·∇z + η(t) | particles descend the gradient — central differences, ε = 0.01 |
| 05Particles | 240 | 140 below 720 px |
| 06Render | perspective wireframe, 1.05×z gain | canvas2d strokes — no textures, no assets |
§05 — POSITION
The multi-vendor relay ends here.
The accepted way to build an intelligent product is a relay: a software agency, an ML consultant, a hardware house. Three contracts, three handoffs, three places for the spec to die.
The relay — accepted
Each vendor optimizes its own deliverable. The seams are yours.
- Requirements re-translated at every handoff — lossy by design
- Integration discovered late, resolved as change orders
- The model team never met the board it ships to
- Accountability diffuses across the contract chain
One firm — ours
The team that architects the system writes the firmware.
- One requirements dossier drives software, model, and silicon
- Interfaces decided once — by the people building both sides
- The same reviewers read the schema and the schematic
- Validation runs against the whole product, not a slice of it
Scope your system.
Software, models, or silicon — tell us what you're building and we'll return a dossier, not a pitch.