Product Design · Prototyping
PCB, mechanics, and firmware engineered together.
From proof-of-concept through bring-up and validation, we keep electronics, enclosure, and embedded software under one accountable engineering team.
PCB layoutDFM notes closed
Enclosure fitKeep-outs checked
Firmware bring-upBench build logged
One revisionPCB, enclosure, and firmware aligned through bring-up.
Build-ready recordTest logs, BOM updates, and next-spin decisions documented.
Integrated practice
Most prototype failures happen at vendor seams.
Board layout goes to one shop. Enclosure CAD goes somewhere else. Firmware arrives after the first assembly and discovers keep-out conflicts, tolerance issues, and untested drivers.
We run PCB, mechanical/3D, and embedded work together — same constraints, same revision control, same bench, one accountable team.
Disciplines
Three streams, controlled as one prototype.
PCB
Schematic and layout
Architecture, component selection, multi-layer layout, stack-up, and DFM review coordinated with power, thermal, and enclosure constraints.
Mechanical / 3D
Enclosure and fit-up
CAD, 3D printed or machined parts, tolerance stacks, fixtures, and assembly sequencing tested against populated boards.
Firmware
Bring-up and validation
Board support, drivers, application logic, power profiles, and test firmware developed against the hardware this team designed.
Deliverables
A prototype package that explains what happened next.
We do not stop at a one-off demo. Scope is organized so each revision leaves a useful engineering record.
01 · PCB design
Schematic, layout, and fab package
Schematics, PCB layout, stack-up notes, component decisions, Gerbers, assembly files, and DFM comments.
02 · Mechanical / 3D
Enclosure CAD and fit-up
CAD, print or machining files, interface checks, tolerance notes, and assembly review against the board revision.
PowerPass
I/OScope
ThermalWatch
FitPass
03 · Embedded software
Firmware on real hardware
Board support, drivers, application logic, debug hooks, and test builds tied to the hardware revision.
04 · Bring-up and revision
Test logs and next-spin control
Power-on checks, functional test results, BOM updates, issue logs, and a clear path to the next prototype or production handoff.
Process
Controlled from constraints to validated unit.
- 01Architecture and constraintsPower budget, interfaces, environmental targets, fabrication method, and manufacturing intent set before detail work begins.
- 02Parallel designSchematic, PCB layout, enclosure CAD, and firmware architecture progress together so conflicts are resolved in review.
- 03Fabrication and assemblyBoards, parts, components, and bench assembly move under controlled revision numbering and documented assumptions.
- 04Bring-up and validationPower-on, functional testing, fault notes, firmware updates, and revision decisions captured for the next step.
Prototype record
Revision evidence before the next build.
- PCB coordinatesA3 / U7
- BOM decisionAlt regulator approved
- Firmware tagbringup-rA.04
- Mechanical noteBoss clearance +0.8 mm
Standard
Prototype work held to an engineering record.
The point is not that a unit lights up once. The point is knowing what changed, why it changed, and what production needs next.
Revision control
Boards, enclosures, firmware builds, BOMs, and test notes are tied to the same revision history.
Documentation
Decisions, failures, test results, and unresolved risks are captured so learning survives the bench.
Production path
DFM notes and next-spin recommendations make the move toward manufacturing a controlled decision, not a restart.
Start with constraints
Tell us what you are building.
Share the concept, timeline, technical constraints, and what the prototype must prove. We will map the right path forward if the fit is there.